CTS, universal service provider for process and production automation, presents a fully automated packaging system for so-called Front Opening Shipping Boxes (FOSB). The system increases efficiency and quality, reduces the error rate and relieves the burden on staff.
The preparation of wafers for transportation to semiconductor production is a complex process and is subject to the strictest quality criteria. The sensitive products are stored in special containers known as Front Opening Shipping Boxes (FOSBs). These must be carefully packaged in absolutely leak-proof plastic bags under cleanroom conditions.
“Packaging is always a uniform process, but it has to be absolutely reliable – after all, the contents are sensitive and expensive,” explains Alfred Pammer, Head of Sales and Marketing at CTS. “If it is carried out manually, errors are inevitable simply because of the monotonous nature of the work – and qualified applicants for such a job are rare. It therefore made sense to automate the entire process. And here at CTS we have found a very efficient and reliable solution.”
The new autobagging tool combines the packaging machine, test chamber, handling robot and all other components in one complete cell. All packaging and inspection processes take place here without manual assistance.
Fully automated packaging, labeling and testing
The unpackaged FOSBs with the wafers are first placed on a conveyor belt by Overhead Hoist Transfer (OHT), Autonomous Mobile Robot (AMR) or operator and from there enter the system. A cross-slot check and add-on part check are then carried out to determine whether processing is possible with the current configuration. The front opening shipping boxes are then packed first in an inner bag and then in an outer bag filled with desiccant. After gluing, the tightness of the packaging is checked individually for each unit using a test gas. The FOSB and wrapping are given a label, the quality and correct placement of which is also checked. The finished packaged products then leave the system via an outfeed conveyor. If the system detects faults, the affected units are automatically moved out for visual inspection. The throughput is 3,000 to 8,000 FOSBs per month, which corresponds to around 75,000 to 200,000 wafers.
A semi-automated version of the autobagging tool is also available for companies with a lower throughput. Here, employees feed and remove the FOSBs from the packaging unit and the test chamber.
Can be combined with other automation solutions from CTS
“With our autobagging tool, we have automated another important production step,” summarizes Pammer. “Our solution avoids all too human errors, it works more efficiently and better than conventional manual workflows. In most cases, no set-up time is required. It also noticeably reduces dust pollution. The new system fits harmoniously into our portfolio. Both the transfer of the FOSBs to the infeed conveyor and the collection from the outfeed conveyor do not have to be done manually. The Smart Logistics material logistics solutions from CTS enable a completely autonomous, automated transport process without the need for costly conversion work in the production environment. And with our Smart Warehouse, we even offer a suitable and also fully automated interim storage solution.”